ADHESIVE RESINS


Our epoxy, urethane and silicone formulated adhesives & sealants are
characterized by very high peel and shear strenght,excellent adhesion
to metals and plastics, including glass, ceramic, gold, PVC and rubbers;
solvent, acid and alkali resistant. Most product are available in our easy
to use Mixpac cartriges, Burst pac's and syringes. They are also available
in various bulk kit sizes as well.

Product
Name
Description Mixed Vis.
Ratio/Pot life
Gel(RT)
Cure*
Hardness
Strenght
Operating °C
Tg
Click for TDS EPOXY  (TWO PART)
ACE-56155 Black Filled epoxy
Electrically Conductive non AG
30,000
4:1/40min
24-72hr* 82D
4,600
-55° to +150°
PTE-47850 Black Filled Epoxy
Excellent thermally conductive
6,500
4:1/60min
2hr
24hr*
80D
3,000
-55° to +150°
122°C
PTE-47851 Black Filled epoxy
Excellent thermally conductive
40,000
4:1/60min
75min
24hr*
90D
2,800
-55° to +150°
122°C
ATE-26522 Black Filled Epoxy
Heat cure for low stress
40,000
10:1/8hr
1min* 92D
2,800
-55° to +180°
137°C
ANE-57100 Amber, Black Epoxy
Staking & General Purpose
10,000
1:1/3min
5min
10min*
65D
4,000
-50° to +130°
80°C
ANE-36142
(EGA-142)
Amber Epoxy
Ferrite Core Bonding
Passes
outgassing
1,200
1:33/4hr
1hr* 83D
3,800
-50° to +150°
113°C
ANE-57103 Amber & Black Epoxy
Staking & General Purpose
10,000
1:1/5min
10min
20min*
65D
4,000
-50° to +130°
80°C
ANE-46515 Amber & Black Epoxy
Passes
outgassing
40,000
1:1/10min
15min
24hr*
70A
4,500
-40° to +140°80°C
ANE-46505 Amber & Black Epoxy
Passes
outgassing
30,000
1:1
2hr
24hr*
70D
4,600
-55° to +140°80°C
ANE-46507 Amber & Black Epoxy
Passes
outgassing
13,000
1:1/10min
2hr
24hr*
70A
4,500
-40° to +140°80°C
ANE-46509 Amber & Black Epoxy
Passes
outgassing
11,000
1:1
2hr
24hr*
70D
4,600
-55° to +140°80°C
ANE-26144
(EGA-144)
Amber unfilled Epoxy
Ferrite & optical Bonding
3,700
10:1/3days
1 min* 88D
3,200
-55° to +180°
137°C
ANE-47204 Amber Epoxy (general purpose)
Staking & Sealing
45,000
1:1/2hr
45min
24hr*
75D
2,500
-40° to +121°
56°C
ANE-47206 Amber Epoxy (general purpose)
Staking & Sealing
70,000
1:1/2hr
60min
24-48hr*
75D
2,500
-40° to +125°
56°C
ANE-47927 White, Green, Gray
Excellent for Stencil Mfg
60,000
2:1/20min
40min
2.5hr*
85D
3,000
-60° to +140°
80°C
PNE-40826 White, Gray Filled Epoxy
Excellent top coat or gap fill
35,000
2:1/30min
20min
45min*
95D
50
-55° to +200°
105°C
ANE-47932 White Filled Epoxy
Excellent for Stencil Mfg
40,000
1:1/4.5hr
25hr* 85D
3,200
-60° to +180°
110°C
PNE-44822 White, Gray Filled Epoxy
Excellent top coat or gap fill
35,000
4:1/30min
20min
45min*
95D
50
-55° to +200°
105°C
TDS HEATSINK BONDING
ATE-46446 Gray Filled Epoxy Paste
Passes
outgassing
8,000
100:9
24hr* 85D
4,200
-55° to +175°
ATE-46439 Gray Filled Epoxy Paste
Passes
outgassing
15,000
100:9
24+hr* 85D
4,200
-55° to +175°
ATE-46440 Gray Filled Epoxy Paste
Passes
outgassing
10,000
100:9
24hr* 85D
4,000
-55° to +200°
TDS INGOT BONDING
ANE-54807M2 Filled Epoxy
Ingot Bonding Adhesive
25,000
1:1
15min
3hr*
300kg/cm2 -40° to +150°
ANE-44038 Filled Epoxy
Beam to Work plate Bonding
20,000
1:1
5min
2hr*
200kg/cm2 -40° to +180°
ANE-44037LP Filled Epoxy
High Temp.Ingot Bonding
24,000
1:1
15min
6hr*
200kg/cm2 -40° to +180°
ANE-50030R Filled Epoxy
Ingot Bonding Adhesive
30,000
1:1
30min
15hr*
200kg/cm2 -40° to +150°
Product
Name
Description Mixed Vis.
Ratio
Cure* Strenght
PSI
Operating °C
Tg
TDS EPOXY  (ONE PART)
ATE-10120 Gray or White Filled Epoxy
Thermally Conductive
25,000
One
3min* 3,000 -55° to +155°
80°C
ANE-26144
(EGA-144)
Amber Unfilled epoxy
Ferrite & Optical Bonding
3,700
One
1min* 3,200 -55° to +180°
137°C
ANE-17794 Amber Unfilled Epoxy
Ferrite & Optical Bonding
6,000
One
1min* 2,600 -55° to +175°
100°C
ANE-16120 Amber Unfilled Epoxy
Ferrite Bonding
3,000
One
3min* 3,000 -55° to +155°
80°C
ATE-26522 Black Filled epoxy
Low CTE Bonding
One
40,000
1min*
2,800 -55° to +180°
137°C
ANE-20961 Black Underfill Epoxy
Board Level Underfill / Flexible
6,000
One
6min* 3,000 -50° to +150°
40°C
BNE-20220 Filled Epoxy
B-Stage Printable
30,000
One
1-10sec* 100n -50°C to +200°C
63°C
BNE-20210 Filled Epoxy
B-Stage Printable
27,000
One
1-10sec* 100n -50°C to +150°C
65°C
ANA-10199R White Epoxy
Re-Workable Underfill.
5,000
One
10min* 1,450 -30°C to +150
0°C
PNE-37850 Water Clear Epoxy
Encapsulation & Adhesive
1,000
One
30min* 4,500 -50°C to +150°C
80°C
ANE-10701 White Insulating Epoxy
Fast Cure Chip Attach
65,000
One
5-10sec* 3,500 -55°C to +180°C
120°C
ANE-10932 Cream Epoxy
Insulating Chip Attach
25,000
One
1min* 4,500 -50°C to +150°C
150°C
ANE-10931 Grey Insulating Epoxy
Board Level Underfill
25,000
One
60 sec* 2,000 -55°C to +190°C
150°C
ANE-20904 Black Insulating Epoxy
Board Level Fast Flow Underfill
25,000
One
50sec* 2,000 -55°C to +120°C
40°C
ANE-10700 Yellow Insulation Epoxy
No-Flow Board Level Underfill
8,000
One
10sec* 2,000 -55°C to +190°C
150°C
ANA-10710 Black Insulating Epoxy
Smart Card / RFID Die Attach
8,000
One
10sec* 2,000 -55°C to +190°C
150°C
TDS URETHANE (TWO PART)
Product
Name
Description Mixed Vis.
Ratio
Gel(RT)
Cure*
Hardness Operating °C
Tg
PNU-46202 Water Clear Urethane
Excellent for lighting products and Gap filling
8,000
1:1
15min
1hr
80A -55°C to +120°C
-40°C
PNU-56200 Amber or Black Urethane
Excellent for fast cure applications
5,000
4:1
5min
1hr
90A -55°C to +125°C
-38°C
PNU-46205 Water Clear Urethane
Good protection and Gap filling
8,000
1:1
45min
3hr
80A -65°C to +150°C
-40°C
TDS SILICONE (TWO PART)
PNS-56228 Clear Toughened Silicone
Tough & durable
60,000
1:1
5min
30min
45A -55 to +200
TDS UV (ONE PART)
Product Description Hardness Viscosity Absorption %
Shrinkage
Operating Temp. °C
ANA-97290 Glass Fixturing
Lens Apps
.
75D 50 0.5
0.3
-40 to +175
ANO-90161 Glass Fixturing
High Heat Apps
80D 350 0.5
<1.0
-50 to +200
ANA-97773 Glass Fixturing
88D 200 1.0
<1.0
-40 to +175
IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended.
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